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    晶圆级封装(WLCSP)

    概述

    AG庄闲 SPI NOR Flash 和 SPI NAND Flash 提供 4Mb至 2Gb 的晶圆级封装(WLCSP,Wafer Level Chip Scale Packaging)版本。与传统塑料封装不同,WLCSP 是一种晶圆级封装,其封装尺寸与裸芯片相同。我们的最小 WLCSP 封装尺寸长度和宽度均可低于 1mm,厚度仅 0.25mm,为紧凑型电路板设计提供了显著的尺寸优势。同时,WLCSP 封装还可改善芯片的散热性能,提高数据传输的稳定性。 

    从小型化到低功耗,AG庄闲通过 WLCSP 封装突破了存储器器件的物理限制,目前已被广泛应用于可穿戴设备等领域。随着微型化市场需求的发展,WLCSP 封装将继续成为当前及未来重要的封装形式之一。

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      39个结果

      • 电压

        • 1.2V

        • 1.65V~3.6V

        • 1.8V

        • 1.8V VCC, 1.2V VIO

      • 容量

        • 2Mb

        • 4Mb

        • 8Mb

        • 16Mb

        • 32Mb

        • 64Mb

        • 128Mb

        • 256Mb

        • 512Mb

      Loading
      Part No

      状态

      电压

      容量

      温度(工规)

      频率(MHz)

      主要特性

      主要封装

      MP1.8V512Mb-40℃~85℃,-40℃~105℃,-40℃~125℃200(x1 x8),200(x8 DTR)ECC,H/W RESET,WP#,Secured OTPSOP16 300mil,TFBGA24 5x5 ball array,WLCSP (4x6 ball array)
      MP1.8V VCC, 1.2V VIO256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4),104(x4 DTR)H/W RESET,Secured OTP,SuspendTFBGA24 5x5 ball array
      MP1.8V256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃200(x1 x8),200(x8 DTR)ECC,H/W RESET,WP#,Secured OTPSOP16 300mil,TFBGA24 5x5 ball array,WLCSP (4x6 ball array)
      MP1.8V256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃166(x1 x2 x4),104(x4 DTR)H/W RESET,WP#,Secured OTP,SuspendWSON8 6x5mm,WLCSP (4-4 ball array)
      MP1.2V128Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4),80(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP8 208mil,USON8 4x4mm,WSON8 6x5mm,TFBGA24 5x5 ball array,WLCSP (4-4 ball array)
      MP1.65V~3.6V128Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4),66(x4 DTR)H/W RESET,WP#,Secured OTP,SuspendSOP8 150mil,SOP8 208mil,USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm,WLCSP (4-4 ball array)
      MP1.8V128Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4)H/W RESET,WP#,Secured OTP,SuspendSOP8 208mil,USON8 4x4mm,WSON8 6x5mm,WSON8 8x6mm
      MP1.8V128Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4),104(x4 DTR)H/W RESET,WP#,Secured OTP,SuspendFO-USON8 3x3mm,USON8 4x4mm,WSON8 6x5mm,VSOP8 208mil,WLCSP (4-4 ball array)
      MP1.2V64Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4),80(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP8 208mil,USON8 3x4mm,USON8 4x4mm,WLCSP (4-4 ball array)
      MP1.65V~3.6V64Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 208mil,USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm,WLCSP (3-2-3 ball array)
      MP1.65V~3.6V64Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4),66(x4 DTR)H/W RESET,WP#,Secured OTP,SuspendSOP8 150mil,SOP8 208mil,USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm,WLCSP (4-4 ball array),FO-USON8 3x2mm
      MP1.8V64Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 208mil,USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm,WLCSP (4-4 ball array)
      MP1.8V64Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4),104(x4 DTR)WP#,Secured OTP,SuspendSOP8 208mil,USON8 3x4mm,FO-USON8 3x2mm,USON8 4x4mm,WLCSP (4-4 ball array)
      MP1.2V32Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4),80(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP8 150mil,SOP8 208mil,USON8 3x2mm,USON8 3x4mm,WLCSP (3-2-3 ball array)
      MP1.8V32Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 208mil,USON8 3x2mm,USON8 3x4mm,WLCSP (4-4 ball array),WLCSP (3-2-3 ball array)
      MP1.8V32Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4),104(x4 DTR)WP#,Secured OTP,SuspendUSON8 3x2mm,USON8 3x4mm,USON8 4x4mm,WLCSP (4-4 ball array),WLCSP (3-2-3 ball array)
      MP1.2V16Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4),80(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP8 150mil,SOP8 208mil,USON8 3x2mm,USON8 3x4mm,WLCSP (3-2-3 ball array)
      MP1.8V16Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 150mil,SOP8 208mil,USON8 3x2mm,USON8 3x4mm,WLCSP (3-2-3 ball array)
      MP1.8V16Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4),104(x4 DTR)WP#,Secured OTP,SuspendSOP8 208mil,USON8 3x2mm,WLCSP (3-2-3 ball array)
      MP1.2V8Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4),80(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP8 150mil,SOP8 208mil,USON8 3x2mm,WLCSP (4-4 ball array)
      MP1.8V8Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4),104(x4 DTR)WP#,Secured OTP,SuspendSOP8 150mil,USON8 3x2mm,WLCSP (4-4 ball array)
      MP1.65V~3.6V4Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 150mil,USON8 1.5x1.5mm,USON8 3x2mm,WLCSP (4x6 ball array)
      MP1.65V~3.6V2Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 150mil,USON8 3x2mm,USON8 1.5x1.5mm,WLCSP (2x3 ball array)
      S1.2V256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4),80(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP8 208mil,SOP16 300mil,WSON8 6x5mm,WLCSP (4-4 ball array)
      NR1.8V512Mb-40℃~85℃,-40℃~105℃,-40℃~125℃166(x1 x4),90(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPSOP16 300mil,WSON8 8x6mm,TFBGA24 5x5 ball array,WLCSP (3-2-3 ball array)
      NR1.8V256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃166(x1 x4),104(x4 DTR)Default 4I/O,H/W RESET,WP#,Secured OTPWSON8 6x5mm,WSON8 8x6mm,TFBGA24 5x5 ball array,WLCSP (4-4 ball array),WLCSP (3-2-3 ball array)
      NR1.8V256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃166(x1 x2 x4),104(x4 DTR)Default 4I/O,H/W RESET,Secured OTP,SuspendWSON8 6x5mm,WLCSP (4-4 ball array)
      NR1.8V256Mb-40℃~85℃,-40℃~105℃,-40℃~125℃133(x1 x2 x4)H/W RESET,WP#,Secured OTP,SuspendWSON8 6x5mm,WLCSP (4-4 ball array)
      NR1.8V128Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 208mil,VSOP8 208mil,WSON8 6x5mm,WSON8 8x6mm,WLCSP (4-4 ball array)
      NR1.8V128Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4)Default 4I/O,Secured OTP,SuspendSOP8 208mil,VSOP8 208mil,WSON8 6x5mm,WLCSP (4-4 ball array)
      NR1.8V32Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 208mil,USON8 3x4mm,WLCSP (4-4 ball array)
      NR1.8V32Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4)WP#,Secured OTP,SuspendUSON8 3x4mm,USON8 4x4mm,WLCSP (4-4 ball array)
      NR1.8V32Mb-40℃~85℃,-40℃~105℃,-40℃~125℃120(x1 x2 x4)Default 4I/O,Secured OTP,SuspendSOP8 208mil,USON8 3x4mm,USON8 4x4mm,WSON8 6x5mm
      NR1.8V16Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 150mil,SOP8 208mil,USON8 3x4mm
      NR1.8V16Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 208mil
      NR1.8V8Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 150mil,SOP8 208mil,USON8 3x2mm,WSON8 6x5mm
      NR1.8V8Mb-40℃~85℃,-40℃~105℃,-40℃~125℃104(x1 x2 x4)WP#,Secured OTP,SuspendSOP8 150mil,USON8 3x2mm,WLCSP (4-4 ball array)
      NR1.65V~3.6V4Mb-40℃~85℃,-40℃~105℃,-40℃~125℃100(x1),80(x2)WP#SOP8 150mil,USON8 1.5x1.5mm,USON8 3x2mm,WLCSP (4-4 ball array)
      NR1.65V~3.6V2Mb-40℃~85℃,-40℃~105℃,-40℃~125℃100(x1),80(x2)WP#SOP8 150mil,USON8 1.5x1.5mm,USON8 3x2mm,WLCSP (4-4 ball array)

      状态说明:MP:量产阶段,UD:开发中,S:样品阶段,NR:不推荐

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